- All sections
- H - Electricity
- H05K - Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components
- H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
Patent holdings for IPC class H05K 3/38
Total number of patents in this class: 1376
10-year publication summary
|
124
|
103
|
124
|
109
|
134
|
113
|
116
|
111
|
89
|
25
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| JX Nippon Mining & Metals Corporation | 1576 |
54 |
| Sumitomo Electric Industries, Ltd. | 14131 |
40 |
| Mitsui Mining & Smelting Co., Ltd. | 1373 |
40 |
| Atotech Deutschland GmbH | 586 |
35 |
| Kyocera Corporation | 12735 |
32 |
| Mitsubishi Materials Corporation | 2378 |
32 |
| Sumitomo Electric Printed Circuits, Inc. | 267 |
31 |
| LG Innotek Co., Ltd. | 6758 |
25 |
| Murata Manufacturing Co., Ltd. | 22355 |
24 |
| DIC Corporation | 3597 |
24 |
| Toshiba Materials Co., Ltd. | 600 |
19 |
| Ibiden Co., Ltd. | 1724 |
18 |
| Denka Company Limited | 2189 |
18 |
| FUJIFILM Corporation | 27102 |
16 |
| Shinko Electric Industries Co., Ltd. | 1186 |
16 |
| The Furukawa Electric Co., Ltd. | 3486 |
16 |
| MEC Company Ltd. | 76 |
16 |
| Panasonic Intellectual Property Management Co., Ltd. | 27812 |
14 |
| Namics Corporation | 393 |
14 |
| NGK Insulators, Ltd. | 4589 |
13 |
| Other owners | 879 |